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CompanyORGANIK KIMYA
BrandINNOFIX SIGNATURE PACKAGING
No Stand4086
Country Turkey
Contact+902123310000
DescriptionOrganik Kimya has developed a novel process for packaging of hot melt pressure sensitive adhesive (HMPSA) specifically for nonwoven market. Innofix Signature Packaging Technology includes coating of HMPSA with a substantially tack-free hot melt adhesive as a replacement to blown films, offering variety of end use advantages in ease of use, melting speed, filter and nozzle change frequency, energy saving and sustainability.
Category Technology / Know-how transfer and licensing
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