Connecting you with nonwoven solutions.
4 – 7 april 2017 Geneva - Switzerland
New launches/Highlights search
|Brand||INNOFIX SIGNATURE PACKAGING|
|Description||Organik Kimya has developed a novel process for packaging of hot melt pressure sensitive adhesive (HMPSA) specifically for nonwoven market. Innofix Signature Packaging Technology includes coating of HMPSA with a substantially tack-free hot melt adhesive as a replacement to blown films, offering variety of end use advantages in ease of use, melting speed, filter and nozzle change frequency, energy saving and sustainability.|
Technology / Know-how transfer and licensing|