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> backCompany | ORGANIK KIMYA |
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Brand | INNOFIX SIGNATURE PACKAGING |
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No Stand | 4086 |
Country |
Turkey
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Contact | +902123310000 |
Description | Organik Kimya has developed a novel process for packaging of hot melt pressure sensitive adhesive (HMPSA) specifically for nonwoven market. Innofix Signature Packaging Technology includes coating of HMPSA with a substantially tack-free hot melt adhesive as a replacement to blown films, offering variety of end use advantages in ease of use, melting speed, filter and nozzle change frequency, energy saving and sustainability. |
Category |
Technology / Know-how transfer and licensing
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